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Home
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Technologies
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LASER PROCESSING AND DICING
» Laser Cutting, Scribing and Drilling
Typical products
Thick Film Substrates
Substrates for Chip Resistors
Thin Film Substrates
Spacers, inserts, holders, and other profiled components
Thermally Conductive Insulating Plates and Washers
Available materials
AlN-170
99,6% Al2O3
96% Al2O3
Laser Cutting, Scribing and Drilling
See also
Laser Ablation
Laser Marking
Diamond Dicing and Profiling